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CUSTOM PLATFORM · AMD
AMD Laptop Platform
Configure AMD Ryzen and Ryzen AI laptops for commercial OEM/ODM projects with flexible performance, display and memory options.
ProcessorRyzen 3 / 5 / 7, Ryzen AI and Ryzen AI MAX families
Display14.1-inch to 17-inch · HD, FHD, 2K, 2.5K or 4K
Memory / StorageDDR4 / DDR5 / LPDDR4 / LPDDR5 · SATA or PCIe SSD
Reference MOQ10 units for standard RAM/SSD selection; 200 units for hardware changes
CUSTOMIZATION OVERVIEW
Built around your project requirements.
Platform Selection
Available processors and motherboard solutions are matched to your performance and commercial requirements.Hardware Configuration
Display, memory, storage, wireless, battery, ports and housing are reviewed before quotation.OEM / ODM Support
Logo, OS image, keyboard language, labels, manuals and packaging can be aligned with the project.CUSTOMIZABLE SPECIFICATIONS
Available hardware options.
Processor OptionsFP5: Ryzen 5 3500U, Ryzen 3 3200U, Ryzen 5 3501U; FF3: Ryzen 5 7525U; FP6: Ryzen 7 7730U; FP7: Ryzen 7 7735HS; FP7R2: Ryzen 7 8745HS; FP8: Ryzen 5 216, Ryzen 7 217, Ryzen 5 218, Ryzen 7 253, Ryzen 5 AI 330, Ryzen 7 AI 360 PRO, Ryzen 9 AI 375 PRO, Ryzen 9 AI 470; FP11: Ryzen AI Max PRO 385, Ryzen AI Max+ 388 and Ryzen AI Max+ 395.
Display Resolution1366 × 768, 1920 × 1080 FHD, 2K, 2.5K or 4K, subject to screen size and AMD motherboard display output capability.
Screen Size14.1-inch, 15.6-inch, 16-inch or 17-inch using available AMD-platform tooling.
MemorySO-DIMM DDR4 or DDR5; onboard LPDDR4 or LPDDR5 depending on the platform design.
StorageSATA: 128GB, 256GB, 512GB or 1TB; PCIe 3.0: 128GB, 256GB, 512GB or 1TB; PCIe 4.0: 128GB, 256GB, 512GB or 1TB.
WirelessWi-Fi 5, Wi-Fi 6 or Wi-Fi 6E with compatible Bluetooth options, subject to the AMD motherboard wireless interface.
BatteryCell layout and capacity can be adjusted within existing enclosure space, including 4500mAh, 5000mAh or another project-specific capacity.
PortsUSB 2.0, USB 3.x, USB-C, full-featured USB-C, PD charging, HDMI, Mini HDMI, RJ45, TF card, audio and DC input combinations.
Housing MaterialABS, metal A-cover, metal A+D covers or full-metal chassis, subject to available tooling and structural design.
Fingerprint ReaderFingerprint module can be added or removed. Position depends on the C-cover structure.
KeyboardStandard keyboard or single-color backlit keyboard. Keyboard language can be customized separately.
TPMTPM 2.0 or fTPM support, or an AMD motherboard platform that supports TPM 2.0.
MOQ guidance: If the project only selects RAM or SSD capacity from an existing standard configuration, the MOQ can usually start from 10 units. Changes to CPU platform, motherboard, display, wireless, battery, ports, material, fingerprint reader, backlight or TPM are normally evaluated from 200 units. A new motherboard or new tooling project requires separate confirmation.
PROJECT REVIEW
From configuration to production.
Standard Selection
Standard memory and storage choices can usually start from 10 units.Hardware Changes
Platform, display, wireless, battery, ports, housing and structural changes are normally evaluated from 200 units.New Tooling
New motherboard or new enclosure tooling projects require separate engineering and MOQ confirmation.BUYER FAQ